We are looking for a Semiconductor Process Engineer Lead to join our team
Minimum qualifications:
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
- 4 years of experience working in a Hardware technical environment, or 3 years of experience with an advanced degree.
- Experience with Semiconductor Engineering and Microelectronics Fabrication.
- Experience with Optoelectronics.
Preferred qualifications:
- Master’s degree or PhD in Electrical Engineering, Industrial Engineering, Material Science, Operations Management, Computer Science, Physics, or a specialized field or equivalent practical experience.
- Experience in the area of Chip-Level Multi-Processing (CMP) or wafer grinding or wafer bonding.
Responsibilities
- Design and develop a new back-end of line (BEOL) capability including chemical mechanical polishing (CMP), wafer grinding, and wafer bonding fabrication.
- Identify and evaluate quality and implement new equipment or upgrades.
- Review, propose, optimize, improve, and implement various wafer fabrication processes for yield improvement, defectivity reduction, and manufacturability.
- Own the area process control plan and enhance the process stability through implementation of best known manufacturing methods and statistical process control (SPC).
- Drive the problem resolution process associated with the quality excursion in the fab area encompassing data analytics, methodical problem solving, failure analysis (FA), design of experiments (DOE), and mistake-proof.
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