We are looking for a Test Engineering Team Lead to join our team
Minimum qualifications:
- Master’s degree in Electrical Engineering, Computer Science, related field, or equivalent practical experience.
- 8 years of experience in test engineering or product engineering.
- Experience developing, debugging, and bringing up tests on Advantest equipment for High-Performance Computing (HPC) products in NPI or HVM environments.
- Experience leading and managing people or projects.
Preferred qualifications:
- 10 years of experience in test engineering or product engineering.
- Experience with test development and characterization including JTAG, IJTAG, Scan/ATPG (including Streaming Scan Network (SSN)), Memory BIST and repair (including BISR/BIRA); functional test for ARM or other process cores.
- Experience with IP Testing and characterization for DDR, PCIe, Serdes, USB, PVT sensors, PRMO, or eFuse.
- Experience scripting in Python, Perl, etc.
- Familiarity with other ATE equipment such as Teradyne UltraFlex.
Responsibilities
- Lead the team responsible for ATE test program development and characterization for NPI and pass to High Volume Manufacturing, developing budgets, allocating work, and partnering with vendors and internal cross-functional teams.
- Drive test development projects, including DFT structural tests, IP-level test, functional tests, memory and logic repair, and eFuse programming.
- Develop and execute strategies for SoC Product NPI, bring-up, verification, characterization, and qualification support, including bench test, troubleshooting, test coverage optimization, new product DPPM correlation, and product correlation between system and ATE.
- Be able to back-stop support for production, including test program upgrade and release, volume data analytics, test time reduction and yield improvement, and RMA analysis.
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